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MPF100TL-FCSG325I

MPF100TL-FCSG325I

MPF100TL-FCSG325I

Microsemi Corporation

FPGAs PolarFire? Series 324-LFBGA

SOT-23

MPF100TL-FCSG325I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 324-LFBGA
Supplier Device Package 325-FPGA (11x11)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series PolarFire™
Part StatusActive
Voltage - Supply 0.97V~1.08V
Number of I/O 170
Number of Logic Elements/Cells 109000
Total RAM Bits 7782400
RoHS StatusRoHS Compliant
In-Stock:72 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$270.85000$270.85

MPF100TL-FCSG325I Product Details

MPF100TL-FCSG325I Overview


In the 324-LFBGA package, you will find fpga chips. Its 170 I/Os help it transfer data more efficiently. A fundamental building block contains 109000 logic elements or cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.97V~1.08V . It is a type of FPGA that belongs to the PolarFire? series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The RAM bits that this device offer is 7782400. Its supplier package is called 325-FPGA (11x11).

MPF100TL-FCSG325I Features


170 I/Os
Up to 7782400 RAM bits

MPF100TL-FCSG325I Applications


There are a lot of Microsemi Corporation MPF100TL-FCSG325I FPGAs applications.

  • Scientific Instruments
  • Electronic Warfare
  • Security systems
  • Filtering and communication encoding
  • Distributed Monetary Systems
  • Server Applications
  • Defense Applications
  • Wireless Communications
  • Development Boards and Shields for Microcontrollers
  • Aerospace and Defense

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