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M2S090T-1FCSG325I

M2S090T-1FCSG325I

M2S090T-1FCSG325I

Microsemi Corporation

325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V

SOT-23

M2S090T-1FCSG325I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells86316
Flash Size 512KB
Length 13.5mm
Height Seated (Max) 1.16mm
Width 11mm
RoHS StatusRoHS Compliant
In-Stock:74 items

Pricing & Ordering

QuantityUnit PriceExt. Price
176$146.57500$25797.2

M2S090T-1FCSG325I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion®2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 180 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.It is really beneficial to have system on a chip since there are 325 terminations in total.Using this SoC chip, you have the option of having 180 outputs.There is 1.2V power supply required for system on chip.There are 180 inputs available on the SoC chip.86316 logic cells are present in logic system on chips.The flash is set to 512KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S090T-1FCSG325I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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