This SoC is built on ARM® Cortex®-M3 core processor(s).
A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion®2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.Housed in the state-of-art Tray package.425 I/Os in total are included in this SoC part.It has a 512KB flash.You can get system on chips with similar specs and purposes by searching M2S090S.The wireless SoC works at a frequency of 166MHz.The SoC meaning is based on the core architecture of ARM.-40°C is just enough for the SoC computing to start up.100°C is the designing maximum operating temperature of this SoC system on chip.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090S-1FGG676I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
