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M2S050TS-FGG896I

M2S050TS-FGG896I

M2S050TS-FGG896I

Microsemi Corporation

896 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 377 I/O 1.2V

SOT-23

M2S050TS-FGG896I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 8 Weeks
Package / Case 896-BGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 896
Terminal Finish MATTE TIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B896
Number of Outputs 377
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 377
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 377
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells56340
Flash Size 256KB
Length 31mm
Height Seated (Max) 2.44mm
Width 31mm
RoHS StatusRoHS Compliant
In-Stock:82 items

Pricing & Ordering

QuantityUnit PriceExt. Price
27$146.16704$3946.51008

M2S050TS-FGG896I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 896-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 377 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 896 terminations.A SoC chip like this can have 377 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 377 inputs that can be used.The logic SoC features 56340 logic cells.A flashing 256KB appears on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.


There are a lot of Microsemi Corporation


M2S050TS-FGG896I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

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