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M2S050TS-FCS325

M2S050TS-FCS325

M2S050TS-FCS325

Microsemi Corporation

325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

SOT-23

M2S050TS-FCS325 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e0
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells56340
Flash Size 256KB
Length 11mm
Height Seated (Max) 1.01mm
Width 11mm
RoHS StatusNon-RoHS Compliant
In-Stock:104 items

Pricing & Ordering

QuantityUnit PriceExt. Price
176$88.38449$15555.67024

M2S050TS-FCS325 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 200.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 325 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 200 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 200 inputs is available to the user.56340 logic cells are included in logic system on chips.There is a flash of 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S050TS-FCS325 System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports

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