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M2S050TS-1FCSG325

M2S050TS-1FCSG325

M2S050TS-1FCSG325

Microsemi Corporation

325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

SOT-23

M2S050TS-1FCSG325 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells56340
Flash Size 256KB
Length 11mm
Height Seated (Max) 1.01mm
Width 11mm
RoHS StatusRoHS Compliant
In-Stock:90 items

Pricing & Ordering

QuantityUnit PriceExt. Price
176$98.19898$17283.02048

M2S050TS-1FCSG325 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 325-TFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 50K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 200 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 325 terminations.This SoC chip is capable of having 200 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 200 inputs.System on chips of logic are comprised of 56340 logic cells.This flash has a size of 256KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S050TS-1FCSG325 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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