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M2S050T-FCS325I

M2S050T-FCS325I

M2S050T-FCS325I

Microsemi Corporation

325 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 200 I/O 1.2V

SOT-23

M2S050T-FCS325I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 325-TFBGA, CSPBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e0
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 50K Logic Modules
Number of Logic Cells56340
Flash Size 256KB
Length 11mm
Height Seated (Max) 1.01mm
Width 11mm
RoHS StatusNon-RoHS Compliant
In-Stock:98 items

Pricing & Ordering

QuantityUnit PriceExt. Price
176$88.38449$15555.67024

M2S050T-FCS325I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 200 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 200 inputs that can be used.The logic SoC features 56340 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S050T-FCS325I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances

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