M1A3P600L-FG484 Overview
A 484-BGA package is provided with this component. A total of 235 I/Os allow data to be transferred in a more coherent manner. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 1.14V~1.575V battery. The ProASIC3L series FPGA is a type of FPGA that belongs to the ProASIC3L family of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. This FPGA model is contained in Tray for space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 110592 bFpga chipss. In order to find related parts, use the part number M1A3P600L as a base. This FPGA module has a RAM si13.5kBe of 13.5kB that is sufficient to make sure that the program is able to run normally. This cable has 484 pins and is designed to connect to a computer. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. The maximal operating temperature of this module reaches 70°C. There should be a temperature difference between 0°C and the operating temperature. There are 600000 gates in its basic building block. The registers used in the transfer of and storage of data are 13824 in number. In addfpga semiconductorion, fpga semiconductor is able to support a maximum supply voltage of 1.26V. With a minimum supply voltage of 1.14V, it is able to function. In fact, this FPGA is capable of reaching a speed of 781.25MHz. The supplier of the device package is 484-FPBGA (23x23).
M1A3P600L-FG484 Features
235 I/Os
Up to 110592 RAM bits
484 LABs/CLBs
70°C gates
13824 registers
M1A3P600L-FG484 Applications
There are a lot of Microsemi Corporation M1A3P600L-FG484 FPGAs applications.
- Automotive
- Artificial intelligence (AI)
- Development Boards and Shields for Microcontrollers
- Digital signal processing
- Data Mining
- Distributed Monetary Systems
- Enterprise networking
- Radar and Sensors
- Embedded Vision
- Military DSP
