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LE75183BDSCT

LE75183BDSCT

LE75183BDSCT

Microsemi Corporation

20 Terminations20 Pin Telecom device1 Circuits

SOT-23

LE75183BDSCT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Number of Pins 20
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Terminal Finish MATTE TIN
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Terminal FormGULL WING
Supply Voltage 5V
Function Line Card Access Switch
Qualification StatusNot Qualified
Number of Circuits 1
Telecom IC Type TELECOM CIRCUIT
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS StatusRoHS Compliant
In-Stock:2982 items

LE75183BDSCT Product Details

LE75183BDSCT Overview


Saving board space is achieved with the 20-SOIC (0.295, 7.50mm Width) package.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.Telecommunications equipment consists of 1 circuits.When the voltage for 4.5V~5.5V is provided, improved efficiency can be achieved.A -40°C~85°C-temperature setting offers reliable performance.A Surface Mount-axis mount is used.There are 20 terminations can be found in telecom switching configuration.5V is its supply voltage.20 pins are located on this telecom interface.Telecom ICs are of type TELECOM CIRCUIT.

LE75183BDSCT Features


Available in the 20-SOIC (0.295, 7.50mm Width) package
TELECOM CIRCUIT as telecom IC type

LE75183BDSCT Applications


There are a lot of Microsemi Corporation LE75183BDSCT Telecom applications.

  • LAN Routers
  • Multiplexers
  • PDH Multiplexers
  • NIU
  • E1 Multiplexer
  • Fiber in the loop (FITL)
  • Fiber to the Home (FTTH)
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Digital Cross Connect Systems
  • Inverse Multiplexing for ATM (IMA)

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