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A2F500M3G-FGG256I

A2F500M3G-FGG256I

A2F500M3G-FGG256I

Microsemi Corporation

-40°C~100°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O

SOT-23

A2F500M3G-FGG256I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F500M3G
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 2mA
Number of I/O MCU - 25, FPGA - 66
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Number of Gates500000
Max Frequency 100MHz
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS StatusRoHS Compliant
In-Stock:1081 items

A2F500M3G-FGG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A ARM® Cortex®-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 256-LBGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion® series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.Housed in the state-of-art Tray package.MCU - 25, FPGA - 66 I/Os in total are included in this SoC part.It has a 512KB flash.You can get system on chips with similar specs and purposes by searching A2F500M3G.The wireless SoC works at a frequency of 80MHz.The SoC meaning is based on the core architecture of ARM.This is the 256-pin version of the computer SoC.-40°C is just enough for the SoC computing to start up.100°C is the designing maximum operating temperature of this SoC system on chip.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-FGG256I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors

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