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A2F500M3G-FG256M

A2F500M3G-FG256M

A2F500M3G-FG256M

Microsemi Corporation

256 Terminations -55°C~125°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V

SOT-23

A2F500M3G-FG256M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Surface MountYES
Package / Case 256-LBGA
Number of Pins 256
Series SmartFusion®
PackagingTray
Operating Temperature-55°C~125°C TJ
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 1.5V
Terminal Pitch1mm
Reach Compliance Code unknown
Frequency 80MHz
Base Part Number A2F500M3G
Number of Outputs 66
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Organization 11520 CLBS, 500000 GATES
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Length 17mm
Width 17mm
Height Seated (Max) 1.7mm
RoHS StatusNon-RoHS Compliant
In-Stock:1867 items

A2F500M3G-FG256M Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -55°C~125°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 25, FPGA - 66 I/Os are included in this SoC part.A 1.5V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which makes system on a chip possible.A SoC chip with 66 outputs is available.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.There is a 256-pin version of this computer SoC available.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-FG256M System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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