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A2F500M3G-CSG288I

A2F500M3G-CSG288I

A2F500M3G-CSG288I

Microsemi Corporation

288 Terminations -40°C~100°C TJ A2F500M3G System On Chip SmartFusion® Series MCU - 31, FPGA - 78 I/O 1.5V

SOT-23

A2F500M3G-CSG288I Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Package / Case 288-TFBGA, CSPBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 288
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch0.5mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F500M3G
JESD-30 Code S-PBGA-B288
Number of Outputs 78
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 31, FPGA - 78
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Number of Inputs 78
Organization 11520 CLBS, 500000 GATES
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Equivalent Gates 500000
Flash Size 512KB
Length 11mm
Height Seated (Max) 1.05mm
Width 11mm
RoHS StatusRoHS Compliant
In-Stock:2249 items

A2F500M3G-CSG288I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 288-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 31, FPGA - 78 I/Os are included in this SoC part.A 1.5V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 288 terminations, which makes system on a chip possible.A SoC chip with 78 outputs is available.A power supply of 1.51.82.53.3V is required.A SoC chip with 78 inputs is available.A 512KB flash can be seen on it.Search A2F500M3G for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-CSG288I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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