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A2F500M3G-1FGG256I

A2F500M3G-1FGG256I

A2F500M3G-1FGG256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V

SOT-23

A2F500M3G-1FGG256I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-LBGA
Surface MountYES
Number of Pins 256
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®
Published 2013
JESD-609 Code e1
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F500M3G
Number of Outputs 66
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.575V
Power Supplies1.51.82.53.3V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates500000
Number of Logic Blocks (LABs) 24
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4018 items

A2F500M3G-1FGG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


A core processor ARM® Cortex®-M3 is embedded in this SoC.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion® is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of MCU - 25, FPGA - 66 I/Os in total.A power supply with a 1.5V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 256 terminations in total, which does really benefit system on a chip.The SoC chip that comes with this module can be configured to have 66 outputs.In order to use system on chip, you will need a power supply of 1.51.82.53.3V.This flash has a size of 512KB.A2F500M3G can help you find system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 100MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.This is the version with 256 pins.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F500M3G-1FGG256I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare

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