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A2F200M3F-1FGG256

A2F200M3F-1FGG256

A2F200M3F-1FGG256

Microsemi Corporation

0°C~85°C TJ 256 Pin A2F200 System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O Min 1.425V V Max 1.575V V

SOT-23

A2F200M3F-1FGG256 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®
Published 2013
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F200
Operating Supply Voltage1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage1.575V
Min Supply Voltage1.425V
Memory Size4.5kB
Operating Supply Current 3mA
Number of I/O MCU - 25, FPGA - 66
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 2500
Core Architecture ARM
Number of Gates200000
Max Frequency 120MHz
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers 4608
Flash Size 256KB
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2121 items

A2F200M3F-1FGG256 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 25, FPGA - 66 I/Os.The flash is set to 256KB.By searching A2F200, you can find system on chips with similar specs and purposes.There is 100MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.256 pins are present on this computer SoC.It is just enough to start the SoC computing at 0°C.As designed, this SoC system on chip can operate at a maximum temperature of 85°C.Voltage of maximum supply is 1.575V.The SoC security is powered at least by 1.425V.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-1FGG256 System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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