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A2F060M3E-TQG144I

A2F060M3E-TQG144I

A2F060M3E-TQG144I

Microsemi Corporation

-40°C~100°C TJ A2F060M3E System On Chip SmartFusion® Series MCU - 21, FPGA - 33 I/O

SOT-23

A2F060M3E-TQG144I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Package / Case 144-LQFP
Supplier Device Package 144-TQFP (20x20)
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®
Published 2011
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature100°C
Min Operating Temperature -40°C
Frequency 80MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 21, FPGA - 33
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS StatusRoHS Compliant
In-Stock:4825 items

A2F060M3E-TQG144I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 144-LQFP by the manufacturer.As this SoC chip has 16KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 21, FPGA - 33 I/Os.The flash is set to 128KB.By searching A2F060M3E, you can find system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.It is just enough to start the SoC computing at -40°C.As designed, this SoC system on chip can operate at a maximum temperature of 100°C.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-TQG144I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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