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A2F060M3E-FGG256M

A2F060M3E-FGG256M

A2F060M3E-FGG256M

Microsemi Corporation

-55°C~125°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O Min 1.425V V Max 1.575V V

SOT-23

A2F060M3E-FGG256M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature-55°C~125°C TJ
PackagingTray
Series SmartFusion®
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code8542.39.00.01
Frequency 80MHz
Base Part Number A2F060M3E
Operating Supply Voltage1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage1.575V
Min Supply Voltage1.425V
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS StatusRoHS Compliant
In-Stock:2532 items

A2F060M3E-FGG256M Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


There are ARM® Cortex®-M3 core processors in this SoC.This system on a chip is packaged as 256-LBGA by the manufacturer.As this SoC chip has 16KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The SmartFusion® series contains this system on chip SoC.It is expected that this SoC meaning will operate at -55°C~125°C TJ on average.There is one thing to note about this SoC security: it combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.The flash is set to 128KB.By searching A2F060M3E, you can find system on chips with similar specs and purposes.There is 80MHz frequency associated with the wireless SoC.It uses ARM as its core architecture.256 pins are present on this computer SoC.Voltage of maximum supply is 1.575V.The SoC security is powered at least by 1.425V.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-FGG256M System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system

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