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A2F060M3E-1FG256I

A2F060M3E-1FG256I

A2F060M3E-1FG256I

Microsemi Corporation

256 Terminations -40°C~100°C TJ 256 Pin A2F060M3E System On Chip SmartFusion® Series MCU - 26, FPGA - 66 I/O 1.5V

SOT-23

A2F060M3E-1FG256I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-LBGA
Surface MountYES
Number of Pins 256
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®
Published 2009
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F060M3E
Number of Outputs 66
Operating Supply Voltage1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Number of I/O MCU - 26, FPGA - 66
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers 1536
Number of Equivalent Gates 60000
Flash Size 128KB
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:1034 items

A2F060M3E-1FG256I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 256-LBGA package as per the manufacturer's specifications.A SoC chip with 16KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion® series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of MCU - 26, FPGA - 66 I/Os.For safe operation, it is advisable to utilize a power supply with 1.5V voltage.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 256 terminations in total.In order for this SoC chip to work properly, you can have 66 outputs.As for its flash size, it is 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 100MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.In this computer SoC, there are 256 pins.

ARM® Cortex®-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F060M3E-1FG256I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

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