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2N2919U

2N2919U

2N2919U

Microsemi Corporation

Trans GP BJT NPN 60V 0.03A 6-Pin Case U

SOT-23

2N2919U Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 3-SMD, No Lead
Number of Pins 6
Transistor Element Material SILICON
Operating Temperature200°C TJ
PackagingBulk
Published 2007
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish TIN LEAD
Max Power Dissipation350mW
Peak Reflow Temperature (Cel) 235
[email protected] Reflow Temperature-Max (s) 20
Number of Elements 2
Polarity NPN
Power Dissipation350mW
Transistor Type 2 NPN (Dual)
Collector Emitter Voltage (VCEO) 60V
Max Collector Current 30mA
DC Current Gain (hFE) (Min) @ Ic, Vce 150 @ 1mA 5V
Current - Collector Cutoff (Max) 10μA ICBO
Vce Saturation (Max) @ Ib, Ic 300mV @ 100μA, 1mA
Collector Base Voltage (VCBO) 70V
Emitter Base Voltage (VEBO) 6V
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:203 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$45.78530$4578.53

About 2N2919U

The 2N2919U from Microsemi Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features Trans GP BJT NPN 60V 0.03A 6-Pin Case U.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2N2919U, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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