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W3H128M72E-400SBI

W3H128M72E-400SBI

W3H128M72E-400SBI

Microsemi

W3H128M72E-400SBI datasheet pdf and Memory Cards product details from Microsemi stock available on our website

SOT-23

W3H128M72E-400SBI Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) 4A994.a
Module DRAM Module
Module Density 1Gbyte
Number of Chip per Module 5
Chip Density (bit) 1.8G
Data Bus Width (bit) 72
Max. Access Time (ns) 1.35
Maximum Clock Rate (MHz) 400
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.9
Operating Current (mA) 900
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support Yes
Number of Chip Banks 8
CAS Latency 4
SPD EEPROM Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 4.57(Max)
Package Length 22.1(Max)
Package Width 16.1(Max)
PCB changed 208
Part StatusActive
Pin Count208
Organization 128Mx72
PLL No
Self Refresh Yes
RoHS StatusSupplier Unconfirmed
In-Stock:2209 items

About W3H128M72E-400SBI

The W3H128M72E-400SBI from Microsemi is a high-performance microcontroller designed for a wide range of embedded applications. This component features W3H128M72E-400SBI datasheet pdf and Memory Cards product details from Microsemi stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the W3H128M72E-400SBI, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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