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MT36HTF51272FDZ-667H1D6

MT36HTF51272FDZ-667H1D6

MT36HTF51272FDZ-667H1D6

Micron Technology Inc.

DDR2 SDRAM FBDIMM, 240-PIN, MODULE DENSITY 4GB

SOT-23

MT36HTF51272FDZ-667H1D6 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 240-FBDIMM
Surface MountNO
Number of Pins 240
Published 2010
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 240
Terminal Finish MATTE TIN
Subcategory Other Memory ICs
Technology CMOS
Terminal Position DUAL
Terminal FormNO LEAD
Peak Reflow Temperature (Cel) 260
Terminal Pitch1mm
[email protected] Reflow Temperature-Max (s) 30
Qualification StatusNot Qualified
Operating Temperature (Max) 95°C
Power Supplies1.51.8V
Temperature GradeOTHER
Memory Size4GB
Speed 667MT/s
Memory TypeDDR2 SDRAM
Clock Frequency 333MHz
Organization 512MX72
Output Characteristics 3-STATE
Memory Width 72
Memory Density 38654705664 bit
I/O Type COMMON
Refresh Cycles 8192
RoHS StatusROHS3 Compliant
In-Stock:4456 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$220.50000$22050

About MT36HTF51272FDZ-667H1D6

The MT36HTF51272FDZ-667H1D6 from Micron Technology Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features DDR2 SDRAM FBDIMM, 240-PIN, MODULE DENSITY 4GB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MT36HTF51272FDZ-667H1D6, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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