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ZL40227LDG1

ZL40227LDG1

ZL40227LDG1

Microchip Technology

1 Circuit 750MHz 2:8 Clock Buffer 32-VFQFN Exposed Pad

SOT-23

ZL40227LDG1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Supplier Device Package 32-QFN (5x5)
Operating Temperature-40°C~85°C
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fanout Buffer (Distribution), Multiplexer
Max Operating Temperature85°C
Min Operating Temperature -40°C
Voltage - Supply 2.375V~3.465V
Output LVDS
Operating Supply Voltage3.465V
Number of Circuits 1
Propagation Delay2 ns
Frequency (Max) 750MHz
Input CML, HCSL, LVCMOS, LVDS, LVPECL
Ratio - Input:Output 2:8
Differential - Input:Output Yes/Yes
Max Duty Cycle 5 %
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1196 items

Pricing & Ordering

QuantityUnit PriceExt. Price
490$4.67363$2290.0787

ZL40227LDG1 Product Details

ZL40227LDG1 Overview


A 32-VFQFN Exposed Pad case is used for packaging. This package is packaged in the form of a Tray. Under normal circumstances, 750MHz is the maximum value. The mount is made up of Surface Mount. This electronic part is classified as Fanout Buffer (Distribution), Multiplexer. The temperature should be set to -40°C~85°C to ensure reliable performance. It should be capable of operating with a power supply of 2.375V~3.465V volts. Surface Mount is placed within the way of this object. As a result, it produces LVDS. A minimum working temperature of -40°C is required to maintain its reliability. 85°C is the maximum operating temperature required for stable operation. It is recommended to keep the supply voltage at 3.465V to maximize efficiency.

ZL40227LDG1 Features


The operating temperature of -40°C~85°C degrees

ZL40227LDG1 Applications


There are a lot of Microchip Technology ZL40227LDG1 Clock Buffers & Drivers applications.

  • High-end consumer electronics
  • Peak detection
  • Line receiver and signal recovery
  • Synchronous optical network (SONET)
  • Smartphone
  • Storage area network
  • Internet of Things
  • Global positioning system (GPS)
  • Tlecom applications
  • Information equipment

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