VSC8664XIC-03 Overview
BGA package is used to save board space.For telecommunications equipment packing, the Tray method is used.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .During normal operation, a minimum value of -40°C is set for the temperature.100°C is set to the maximum value to ensure normal operation.
VSC8664XIC-03 Features
Available in the BGA package
VSC8664XIC-03 Applications
There are a lot of Microchip Technology VSC8664XIC-03 Telecom applications.
- BITS Timing
- NIU
- Fiber Optic Terminals
- Fault Tolerant Systems
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Wireless base stations
- Home Side Box
- Wireless Local Loop
- Digital Modems
- Digital Access Cross-connect System (DACs)
