VSC8664XIC Overview
BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.The telecom IC is composed of 1 circuits.Ensure normal operation by setting the temperature to 0°C minimum.The temperature is set at the maximum value of 90°C to ensure normal operation.
VSC8664XIC Features
Available in the BGA package
VSC8664XIC Applications
There are a lot of Microchip Technology VSC8664XIC Telecom applications.
- Network Multiplexing and Terminating Equipment
- Interfaces to E3
- Fiber to the Home (FTTH)
- Switches
- E1 LAN/WAN Routers
- Hybrid fiber coax (HFC)
- Stations
- Cable modem
- Fault Tolerant Systems
- Central office
