VSC8572XKS-05 Overview
The 256-BGA package reduces the amount of space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.Telecommunications equipment consists of 2 circuits.When 1V 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.
VSC8572XKS-05 Features
Available in the 256-BGA package
VSC8572XKS-05 Applications
There are a lot of Microchip Technology VSC8572XKS-05 Telecom applications.
- Inverse Multiplexing for ATM (IMA)
- PDH Multiplexers
- Digital Cross-Connect Systems
- Digital access cross connects
- SDH/SONET multiplexers
- Switching Systems
- ISDN terminal adapter
- Digital cross connects (DSX-1)
- M13 MUX
- Fractional T1/E1/J1
