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VSC8564XKS-11

VSC8564XKS-11

VSC8564XKS-11

Microchip Technology

Telecom device

SOT-23

VSC8564XKS-11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-PBGA (17x17)
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS StatusROHS3 Compliant
In-Stock:162 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$59.859538$59.859538
10$56.471262$564.71262
100$53.274776$5327.4776
500$50.259222$25129.611
1000$47.414360$47414.36

VSC8564XKS-11 Product Details

VSC8564XKS-11 Overview


A 256-BGA package saves space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.

VSC8564XKS-11 Features


Available in the 256-BGA package

VSC8564XKS-11 Applications


There are a lot of Microchip Technology VSC8564XKS-11 Telecom applications.

  • High speed data transmission line cards
  • DECT (Digital European Cordless Telephone) Base Stations
  • E1 Multiplexer
  • Digital Modems
  • Digital Cross-connect Systems (DCS)
  • Fault Tolerant Systems
  • Dual battery supply voltage SLICs
  • Public switching systems
  • Fiber to the Home (FTTH)
  • T1/E1/J1 Multiplexer and Channel Banks

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