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VSC8541XMV-03

VSC8541XMV-03

VSC8541XMV-03

Microchip Technology

Telecom device1 Circuits

SOT-23

VSC8541XMV-03 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Supplier Device Package 68-QFN (8x8)
Operating Temperature-40°C~125°C
PackagingTray
Published 2009
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Ethernet
Interface RMII
Number of Circuits 1
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4332 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.720000$6.72
10$6.339623$63.39623
100$5.980776$598.0776
500$5.642242$2821.121
1000$5.322869$5322.869

VSC8541XMV-03 Product Details

VSC8541XMV-03 Overview


In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits make up this telecom IC .Using -40°C~125°C as the operating temperature can result in reliable performance.

VSC8541XMV-03 Features



VSC8541XMV-03 Applications


There are a lot of Microchip Technology VSC8541XMV-03 Telecom applications.

  • Residential Gateways
  • CSU/DSU E1 Interface
  • DECT (Digital European Cordless Telephone) Base Stations
  • T1/E1/J1 LAN/WAN Routers
  • PDH Multiplexers
  • Central office (CO)
  • Switching Systems
  • DECT (Digital European Cordless Telephone) Base
  • Fault Tolerant Systems
  • Home Side Box

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