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VSC8540XMV-03

VSC8540XMV-03

VSC8540XMV-03

Microchip Technology

Telecom device1 Circuits

SOT-23

VSC8540XMV-03 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 68-VFQFN Exposed Pad
Supplier Device Package 68-QFN (8x8)
Operating Temperature-40°C~125°C
PackagingTray
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Ethernet
Interface RMII
Number of Circuits 1
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4085 items

VSC8540XMV-03 Product Details

VSC8540XMV-03 Overview


To save board space, the 68-VFQFN Exposed Pad package is used.Packing is done according to the Tray method.A Surface Mount mounting type is used.A 1-circuit composes this telecom IC .The operating temperature set at -40°C~125°C can offer reliable performance.

VSC8540XMV-03 Features


Available in the 68-VFQFN Exposed Pad package

VSC8540XMV-03 Applications


There are a lot of Microchip Technology VSC8540XMV-03 Telecom applications.

  • ISDN terminal adapter
  • Digital Modems
  • CSU/DSU E1/T1/J1 Interface
  • Stations
  • Digital cross connects (DSX-1)
  • Cross Connects
  • LAN Routers
  • Home Gateway
  • Cable Modem
  • Integrated Access Devices (IADs)

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