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VSC8504XKS-01

VSC8504XKS-01

VSC8504XKS-01

Microchip Technology

256 TerminationsTelecom device1 Circuits

SOT-23

VSC8504XKS-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status LIMITED TIME BUY (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 256-BGA
Surface MountYES
PackagingTray
Part StatusObsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 256
Voltage - Supply 1V
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 1V
JESD-30 Code S-PBGA-B256
Function Ethernet
Temperature GradeOTHER
Number of Circuits 1
Data Rate1 Gbps
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2485 items

VSC8504XKS-01 Product Details

VSC8504XKS-01 Overview


Space is saved on the board by using the 256-BGA package.The way of Tray is employed for telecommunications equipment packing.In this case, Surface Mount is the mounting type.Telecom circuit is made up of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1V is provided.Configuration of this telecom circuit has 256 terminations.It operates at voltage 1V.

VSC8504XKS-01 Features


Available in the 256-BGA package

VSC8504XKS-01 Applications


There are a lot of Microchip Technology VSC8504XKS-01 Telecom applications.

  • Channel Service Units (CSUs): T1/E1/J1
  • Channel Banks
  • DSLAMs
  • T3 channelized access concentrators
  • PBXs channel bank
  • DECT (Digital European Cordless Telephone) Base Stations
  • Fiber in the loop (FITL)
  • CSU/DSU E1/T1/J1 Interface
  • Voice over packet gateways
  • T1/E1/J1 Performance Monitoring

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