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VSC7435XMT

VSC7435XMT

VSC7435XMT

Microchip Technology

Telecom device

SOT-23

VSC7435XMT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 324-BGA
Supplier Device Package 324-BGA (19x19)
PackagingTray
Published 2017
Series Servalâ„¢-TE
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS StatusROHS3 Compliant
In-Stock:126 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$71.98000$71.98
25$59.95640$1498.91
100$57.93750$5793.75

VSC7435XMT Product Details

VSC7435XMT Overview


Space is saved on the board by using the 324-BGA package.For telecommunications equipment packing, the Tray method is used.Surface Mount is used as telecommunications equipment mounting type.With the Serval?-TE series electronic parts, it can perform similar functions of the telecommunication product .

VSC7435XMT Features


Available in the 324-BGA package

VSC7435XMT Applications


There are a lot of Microchip Technology VSC7435XMT Telecom applications.

  • PBX interfaces
  • ISDN Primary Rate Interface
  • ISDN NT1/TA
  • Fiber
  • Central office
  • Channel Banks
  • T1 Rates PCM Line Interface
  • CSU/DSU Equipment
  • Inverse Multiplexing for ATM (IMA)
  • Remote wireless modules

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