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VSC7424XJG-02

VSC7424XJG-02

VSC7424XJG-02

Microchip Technology

Telecom device1 Circuits

SOT-23

VSC7424XJG-02 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 672-BGA
Supplier Device Package 672-HSBGA (27x27)
PackagingTray
Series SparXâ„¢-III-10
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 1V
Function Ethernet Switch
Interface Serial
Number of Circuits 1
Data Rate1 Gbps
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:143 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$44.83000$44.83
25$37.34800$933.7
100$36.08860$3608.86

VSC7424XJG-02 Product Details

VSC7424XJG-02 Overview


A 672-BGA package saves space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.Telecommunications equipment consists of 1 circuits.Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.This part can perform many functions similar to the electronic parts under the SparX?-III-10 series.

VSC7424XJG-02 Features


Available in the 672-BGA package

VSC7424XJG-02 Applications


There are a lot of Microchip Technology VSC7424XJG-02 Telecom applications.

  • DECT (Digital European Cordless Telephone) Base
  • Multi-Line E1 Interface Cards
  • Fiber Optic Terminals
  • CSU/DSU E1 Interface
  • Central office
  • Routers
  • Wireless local loop (WLL)
  • Fiber
  • E3/DS3 Access Equipment
  • Multiplexers

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