VSC7421XJQ-04 Overview
TQFP package is used to save board space.Packing is done according to the Tray method.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1V is provided.This part can perform many functions similar to the electronic parts under the SparX?-III-17um series.To ensure normal operation, -40°C must be set at a minimum value.Normal operation is ensured by setting 125°C to the maximum value.
VSC7421XJQ-04 Features
Available in the TQFP package
VSC7421XJQ-04 Applications
There are a lot of Microchip Technology VSC7421XJQ-04 Telecom applications.
- Interfaces to DS3
- Fiber to the Home (FTTH)
- SONET/SDH terminal
- T1 Digital Cross Connects (DSX-1)
- Public switching systems
- Digital Cross-Connect Systems
- CSU/DSU Equipment
- Channel Banks
- E1 Multiplexer
- T1/E1/J1 Performance Monitoring
