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TSPC603RVGS12LC

TSPC603RVGS12LC

TSPC603RVGS12LC

Microchip Technology

PowerPC 603e Microprocessor -- Series TSPC603 255-BCBGA Exposed Pad

SOT-23

TSPC603RVGS12LC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 255-BCBGA Exposed Pad
Supplier Device Package 255-CI-CGA (21x21)
Product Status Obsolete
Mfr Microchip Technology
Base Product Number TSPC603
Package Tray
Series --
Published 2005
PackagingTray
Operating Temperature-40°C~110°C TC
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number TSPC603
Speed 266MHz
Core Processor PowerPC 603e
Voltage - I/O 3.3V
Ethernet --
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers --
USB --
Additional Interfaces --
Co-Processors/DSP --
Security Features--
Display & Interface Controllers--
SATA --
RoHS StatusNon-RoHS Compliant
In-Stock:3364 items

TSPC603RVGS12LC Product Details

TSPC603RVGS12LC Overview


With a packing size of 255-BCBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~110°C TC. A -- series item. A PowerPC 603e processor is present in this CPU. The CPU contains -- RAM controllers. This microprocessor is equipped with an interface of --. 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with TSPC603. A supplier offers a 255-CI-CGA (21x21) package.

TSPC603RVGS12LC Features


PowerPC 603e Core


TSPC603RVGS12LC Applications


There are a lot of Microchip Technology
TSPC603RVGS12LC Microprocessor applications.


  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
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  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances

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