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PM8324-FEI

PM8324-FEI

PM8324-FEI

Microchip Technology

Telecom device

SOT-23

PM8324-FEI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
PackagingTray
Published 2008
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Framer
Interface E1, T1
RoHS StatusROHS3 Compliant
In-Stock:3763 items

Pricing & Ordering

QuantityUnit PriceExt. Price
60$212.33450$12740.07

PM8324-FEI Product Details

PM8324-FEI Overview


A Tray-packing method is used to pack telecommunications equipment.

PM8324-FEI Features



PM8324-FEI Applications


There are a lot of Microchip Technology PM8324-FEI Telecom applications.

  • ATM equipment with integrated DS1 interfaces
  • PBXs channel bank
  • DECT (Digital European Cordless Telephone) Base
  • Switching Systems
  • Remote wireless modules
  • Frame Relay Switches and Access Devices (FRADS)
  • Digital Access Cross-connect System (DACs)
  • Wireless local loop (WLL)
  • Digital cross connects (DSX-1)
  • Switches

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