PCX755BVZFU300LE Overview
With a packing size of 360-BBGA Exposed Pad, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~110°C TJ. A -- series item. A PowerPC processor is present in this CPU. The CPU contains -- RAM controllers. This microprocessor is equipped with an interface of --. 2.5V 3.3V is the CPU's I/O address. You can search for variants of a microprocessor with PCX755. A supplier offers a 360-PBGA (25x25) package.
PCX755BVZFU300LE Features
PowerPC Core
PCX755BVZFU300LE Applications
There are a lot of Microchip Technology
PCX755BVZFU300LE Microprocessor applications.
- Radio
- Television
- Heater/Fan
- Calculator
- Kindle
- Christmas lights
- 3D printers
- Washing machine
- Microwave ovens
- Home appliances
