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PCX745BVZFU300LE

PCX745BVZFU300LE

PCX745BVZFU300LE

Microchip Technology

PowerPC Microprocessor -- Series PCX745 255-BBGA Exposed Pad

SOT-23

PCX745BVZFU300LE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 255-BBGA Exposed Pad
Mounting Type Surface Mount
Supplier Device Package 255-PBGA (21x21)
Package Tray
Base Product Number PCX745
Mfr Microchip Technology
Product Status Obsolete
Operating Temperature-40°C~110°C TJ
PackagingTray
Published 2006
Series --
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PCX745
Speed 300MHz
Core Processor PowerPC
Voltage - I/O 2.5V 3.3V
Ethernet --
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers --
USB --
Additional Interfaces --
Co-Processors/DSP --
Security Features--
Display & Interface Controllers--
SATA --
RoHS StatusNon-RoHS Compliant
In-Stock:2935 items

PCX745BVZFU300LE Product Details

PCX745BVZFU300LE Overview


The microprocessor is convenient for international shipping since it is packaged in 255-BBGA Exposed Pad. The packaging method Tray provides high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around -40°C~110°C TJ should be understood. This is part of the -- series. The CPU is powered by a PowerPC core. There are -- RAM controllers on this CPU. This microprocessor features -- interfaces to better serve its users. The CPU runs I/O at 2.5V 3.3V. Using PCX745 will help you find variants of the cpu microprocessor. Suppliers offer 255-PBGA (21x21) packages.

PCX745BVZFU300LE Features


PowerPC Core


PCX745BVZFU300LE Applications


There are a lot of Microchip Technology
PCX745BVZFU300LE Microprocessor applications.


  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle

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