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MT8870DN1

MT8870DN1

MT8870DN1

Microchip Technology

20 Terminations5V 20 Pin Telecom device1 Circuits

SOT-23

MT8870DN1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-SSOP (0.209, 5.30mm Width)
Number of Pins 20
Weight 453.59237mg
Operating Temperature-40°C~85°C
PackagingTube
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Terminal Finish MATTE TIN
Subcategory Telecom Signaling Circuits
Max Power Dissipation500mW
Technology CMOS
Voltage - Supply 4.75V~5.25V
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch0.65mm
Frequency 3.58MHz
[email protected] Reflow Temperature-Max (s) 30
Function DTMF Receiver
Operating Supply Voltage5V
Power Supplies
In-Stock:5447 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.541935$1.541935
10$1.454656$14.54656
100$1.372317$137.2317
500$1.294638$647.319
1000$1.221357$1221.357

About MT8870DN1

The MT8870DN1 from Microchip Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features 20 Terminations5V 20 Pin Telecom device1 Circuits.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MT8870DN1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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