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MCP47FVB21A3-E/ST

MCP47FVB21A3-E/ST

MCP47FVB21A3-E/ST

Microchip Technology

DAC Voltage - Buffered Surface Mount R-2R R 3mm mm

SOT-23

MCP47FVB21A3-E/ST Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface MountYES
Operating Temperature-40°C~125°C
PackagingTube
Published 2016
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB21
JESD-30 Code R-PDSO-G8
Output Type Voltage - Buffered
Number of Bits 12
Architecture R-2R
Converter Type D/A CONVERTER
Reference TypeExternal, Internal, Supply
Data InterfaceI2C
Differential OutputNo
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time6μs (Typ)
Input Bit Code BINARY
INL/DNL (LSB) ±1.5, ±0.2
Input Format SERIAL
Number of D/A Converters 1
Analog Output Voltage-Max 5.46V
Length 4.4mm
Width 3mm
RoHS StatusROHS3 Compliant
In-Stock:4873 items

Pricing & Ordering

QuantityUnit PriceExt. Price
400$1.01970$407.88

MCP47FVB21A3-E/ST Product Details

MCP47FVB21A3-E/ST Overview


A 8-TSSOP (0.173, 4.40mm Width) package contains it, and it is available for download. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Operating temperatures should be maintained within the -40°C~125°C range at all times when the unit is in use. A model of this FPGA is contained in Tube for the purpose of saving space. In total, there are a total of 8 terminations on it. For related parts, use its base part number MCP47FVB21.

MCP47FVB21A3-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package


MCP47FVB21A3-E/ST Applications


There are a lot of Microchip Technology
MCP47FVB21A3-E/ST Digital to Analog Converters (DAC) applications.


  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment

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