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MCP47FVB21A0T-E/ST

MCP47FVB21A0T-E/ST

MCP47FVB21A0T-E/ST

Microchip Technology

DAC Voltage - Buffered Surface Mount R-2R R 3mm mm

SOT-23

MCP47FVB21A0T-E/ST Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface MountYES
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2016
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB21
JESD-30 Code R-PDSO-G8
Output Type Voltage - Buffered
Number of Bits 12
Architecture R-2R
Converter Type D/A CONVERTER
Reference TypeExternal, Internal, Supply
Data InterfaceI2C
Differential OutputNo
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time6μs (Typ)
Input Bit Code BINARY
INL/DNL (LSB) ±1.5, ±0.2
Input Format SERIAL
Number of D/A Converters 1
Analog Output Voltage-Max 5.46V
Length 4.4mm
Width 3mm
RoHS StatusROHS3 Compliant
In-Stock:6550 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MCP47FVB21A0T-E/ST Product Details

MCP47FVB21A0T-E/ST Overview


In the package 8-TSSOP (0.173, 4.40mm Width), this product is provided. By attaching the Surface Mount connector, you can use this FPGA module with your development board. It is necessary to keep the operating temperature within -40°C~125°C when the device is operating. As a result of space limitations, this FPGA model has been included in Tape & Reel (TR). In total, the terminations of this piece are 8. MCP47FVB21 is the base part number that can be used to identify related parts.

MCP47FVB21A0T-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package


MCP47FVB21A0T-E/ST Applications


There are a lot of Microchip Technology
MCP47FVB21A0T-E/ST Digital to Analog Converters (DAC) applications.


  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment
  • Portable Equipment

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