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MCP47FVB11A3T-E/ST

MCP47FVB11A3T-E/ST

MCP47FVB11A3T-E/ST

Microchip Technology

DACVoltage - BufferedSurface Mount R-2R R3mm mm

SOT-23

MCP47FVB11A3T-E/ST Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface MountYES
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2016
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch0.65mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB11
JESD-30 Code R-PDSO-G8
Output Type Voltage - Buffered
Number of Bits 10
Architecture R-2R
Converter Type D/A CONVERTER
Reference TypeExternal, Internal, Supply
Data InterfaceI2C
Differential OutputNo
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time6μs (Typ)
Input Bit Code BINARY
INL/DNL (LSB) ±0.4, ±0.05
Input Format SERIAL
Number of D/A Converters 1
Analog Output Voltage-Max 5.46V
Length 4.4mm
Width 3mm
RoHS StatusROHS3 Compliant
In-Stock:7781 items

Pricing & Ordering

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MCP47FVB11A3T-E/ST Product Details

MCP47FVB11A3T-E/ST Overview


A 8-TSSOP (0.173, 4.40mm Width) package contains it, and it is available for download. By attaching the Surface Mount connector, you can use this FPGA module with your development board. When operating the machine, it is important to keep the temperature within -40°C~125°C range. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In total, it has 8 terminations on each end. Its base part number MCP47FVB11 can be used to find related parts.

MCP47FVB11A3T-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package

MCP47FVB11A3T-E/ST Applications


There are a lot of Microchip Technology MCP47FVB11A3T-E/ST Digital to Analog Converters (DAC)?applications.

  • Audio Amplifier
  • Basestations
  • Instrumentation
  • Servo controls
  • Wireless infrastructure:
  • Microprocessor Controlled Circuits
  • Mobile Communications
  • Bus Structured instruments
  • Digital Potentiometer
  • Closed-loop process control

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