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MCP47FVB02A2T-E/ST

MCP47FVB02A2T-E/ST

MCP47FVB02A2T-E/ST

Microchip Technology

DACVoltage - BufferedSurface Mount R-2R R3mm mm

SOT-23

MCP47FVB02A2T-E/ST Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface MountYES
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2016
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch0.65mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB02
Output Type Voltage - Buffered
Number of Bits 8
Architecture R-2R
Converter Type D/A CONVERTER
Reference TypeExternal, Internal, Supply
Data InterfaceI2C
Differential OutputNo
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time6μs (Typ)
Linearity Error-Max (EL) 0.1953%
Input Bit Code BINARY
INL/DNL (LSB) ±0.1, ±0.0125
Input Format SERIAL
Number of D/A Converters 2
Analog Output Voltage-Max 5.46V
Analog Output Voltage-Min 0.01V
Length 4.4mm
Width 3mm
RoHS StatusROHS3 Compliant
In-Stock:6388 items

Pricing & Ordering

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MCP47FVB02A2T-E/ST Product Details

MCP47FVB02A2T-E/ST Overview


In the 8-TSSOP (0.173, 4.40mm Width) package, you will find it. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Operating temperatures should be maintained within the -40°C~125°C range at all times when the unit is in use. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. In total, it has a total of 8 terminations. Parts related to this part can be found using its base part number MCP47FVB02.

MCP47FVB02A2T-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package

MCP47FVB02A2T-E/ST Applications


There are a lot of Microchip Technology MCP47FVB02A2T-E/ST Digital to Analog Converters (DAC)?applications.

  • Function Generaion
  • Instrumentation:
  • Bus Structured instruments
  • Digital Offset & Gain Adjustment
  • Mobile Communications
  • Precision setpoint control
  • Software Controlled Gain Adjustment
  • Portable Equipment
  • Motor Control
  • Wireless infrastructure:

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