LE89900AMC Overview
The MSOP package reduces the amount of space on a board.In order to pack telecommunications equipment, Tube is used.Mounting type Surface Mount is used.There are 1 circuits in this telecom IC .Flexibility is achieved through 2 channels.
LE89900AMC Features
Available in the MSOP package
LE89900AMC Applications
There are a lot of Microchip Technology LE89900AMC Telecom applications.
- Short/Medium Loop
- PDH Multiplexers
- PCM Test Equipment
- Remote wireless modules
- Digital access cross connects
- T1/E1/J1 LAN/WAN Routers
- Wireless Local Loop
- Digital cross connects (DSX-1)
- SDH/SONET multiplexers
- Cable Modem
