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LE89810BSC

LE89810BSC

LE89810BSC

Microchip Technology

Telecom device1 Circuits

SOT-23

LE89810BSC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOIC
Supplier Device Package 16-SOIC
Weight 665.986997mg
PackagingTube
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Power Dissipation120mW
Number of Channels 2
Interface PCM
Number of Circuits 1
RoHS StatusROHS3 Compliant
In-Stock:2262 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.539345$1.539345
10$1.452212$14.52212
100$1.370012$137.0012
500$1.292464$646.232
1000$1.219306$1219.306

LE89810BSC Product Details

LE89810BSC Overview


To save board space, the SOIC package is used.To pack telecommunications equipment, the way of Tube is used.Telecommunications equipment is mounted using Surface Mount.An 1-circuit makes up this telecom IC .A Surface Mount-axis mount is used.The superior flexibility of the telecom IC is achieved by using 2 channels.

LE89810BSC Features


Available in the SOIC package

LE89810BSC Applications


There are a lot of Microchip Technology LE89810BSC Telecom applications.

  • Fiber Optic Terminals
  • Fiber In The Loop (FITL)
  • Channel Banks
  • E1 Multiplexer
  • E1 Rates PCM Line Interface
  • T1 Digital Cross Connects (DSX-1)
  • Digital access cross connects
  • Public switching systems
  • ISDN NT1/TA
  • BITS Timing

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