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LE88506DVCT

LE88506DVCT

LE88506DVCT

Microchip Technology

Telecom device2 Circuits

SOT-23

LE88506DVCT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TQFP
Supplier Device Package 64-TQFP (10x10)
PackagingTape & Reel (TR)
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V~35V
Function Telecom Circuit
Interface PCM
Number of Circuits 2
RoHS StatusROHS3 Compliant
In-Stock:717 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.595358$2.595358
10$2.448451$24.48451
100$2.309859$230.9859
500$2.179112$1089.556
1000$2.055766$2055.766

LE88506DVCT Product Details

LE88506DVCT Overview


TQFP package is used to save board space.Telecommunications equipment is packed using the Tape & Reel (TR) method.A Surface Mount-mount is used for mounting the telecom circuit.There are 2 circuits in this telecom IC .3.3V~35V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is mounted in the way of Surface Mount.

LE88506DVCT Features


Available in the TQFP package

LE88506DVCT Applications


There are a lot of Microchip Technology LE88506DVCT Telecom applications.

  • SDH Multiplexers
  • Cable Telephony
  • T3 channelized access concentrators
  • Short/Medium Loop
  • T1/E1/J1 Performance Monitoring
  • Integrated Access Devices (IADs)
  • Switches
  • Digital Cross-connect Systems (DCS)
  • Cable PC
  • Fiber

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