LE79114KVC Overview
Saving board space is achieved with the 128-TQFP package.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.When the voltage for 3.3V is provided, improved efficiency can be achieved.Mounted in Surface Mount-direction.
LE79114KVC Features
Available in the 128-TQFP package
LE79114KVC Applications
There are a lot of Microchip Technology LE79114KVC Telecom applications.
- Integrated Access Devices (IADs)
- Central office
- E1 LAN/WAN Routers
- Digital Modems
- Digital loop carrier (DLC)
- CSU/DSU Equipment
- Channel Banks
- Fiber in the loop (FITL)
- Wireless local loop (WLL)
- Routers
