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LE78D110BVC

LE78D110BVC

LE78D110BVC

Microchip Technology

44 Terminations44 Pin Telecom device1 Circuits

SOT-23

LE78D110BVC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 44-TQFP
Number of Pins 44
Operating Temperature-40°C~85°C
PackagingTray
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44
Voltage - Supply 3.3V
Terminal Position QUAD
Terminal FormGULL WING
Supply Voltage 3.3V
Terminal Pitch0.8mm
Function Voice Over IP Processor
Qualification StatusNot Qualified
Interface PCM
Number of Circuits 1
Operating ModeSYNCHRONOUS
Filter YES
Companding Law A/MU-LAW
RoHS StatusROHS3 Compliant
In-Stock:2124 items

LE78D110BVC Product Details

LE78D110BVC Overview


A 44-TQFP package saves space on a board.Telecommunications equipment is packed in the Tray-way.Surface Mount is used as telecommunications equipment mounting type.A 1-circuit composes this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.3V with a higher voltage.A -40°C~85°C-temperature setting offers reliable performance.Mounted in the direction of Surface Mount.Telecom switching configuration contains 44 terminations.It operates at a voltage of 3.3V.The telecom interface has 44 pins.

LE78D110BVC Features


Available in the 44-TQFP package

LE78D110BVC Applications


There are a lot of Microchip Technology LE78D110BVC Telecom applications.

  • Set-Top Box
  • T1/E1/J1 Performance Monitoring
  • Central office (CO)
  • Add/Drop multiplexers (ADMs)
  • Interfaces to SONET STS-1 Networks
  • Fault Tolerant Systems
  • Digital Access Cross-connect System (DACs)
  • Fiber
  • Routers
  • PBXs channel bank

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