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AT6003-4QI

AT6003-4QI

AT6003-4QI

Microchip Technology

FPGAs AT6000(LV) Series 132-BQFP Bumpered

SOT-23

AT6003-4QI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 132-BQFP Bumpered
Operating Temperature-40°C~85°C TC
PackagingTray
Published 1999
Series AT6000(LV)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.5V~5.5V
Base Part Number AT6003
Number of I/O 108
Number of Logic Elements/Cells 1600
Number of Gates9000
RoHS StatusNon-RoHS Compliant
In-Stock:3893 items

AT6003-4QI Product Details

AT6003-4QI Overview


There are two packages that contain fpga chips: 132-BQFP Bumpered package and X package. Having 108 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 1600 logic elements/cells are required. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 4.5V~5.5V is needed in order for fpga chips to operate. As part of the AT6000(LV) series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of -40°C~85°C TC. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Related parts can be found by using its base part number AT6003. There are 9000 gates that make up its basic building block.

AT6003-4QI Features


108 I/Os

AT6003-4QI Applications


There are a lot of Microchip Technology AT6003-4QI FPGAs applications.

  • Security systems
  • Data center hardware accelerators
  • Artificial intelligence (AI)
  • Radar and Sensors
  • Automotive driver's assistance
  • Industrial Ethernet
  • Development Boards and Shields for Microcontrollers
  • High Performance Computing
  • Data Mining
  • Video & Image Processing

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