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XRT86VX38IB256ES

XRT86VX38IB256ES

XRT86VX38IB256ES

MaxLinear, Inc.

Telecom device1 Circuits

SOT-23

XRT86VX38IB256ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature-40°C~85°C
PackagingBulk
Part StatusActive
Voltage - Supply 1.8V 3.3V
Function Framer, Line Interface Unit (LIU)
Interface E1, J1, T1
Number of Circuits 1
RoHS StatusRoHS Compliant
In-Stock:2908 items

XRT86VX38IB256ES Product Details

XRT86VX38IB256ES Overview


Saving board space is achieved with the 256-BGA package.Telecommunications equipment is packed using the Bulk method.The mounting type is Surface Mount.Telecommunications equipment consists of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1.8V 3.3V is provided.At -40°C~85°C, reliable performance can be achieved.

XRT86VX38IB256ES Features


Available in the 256-BGA package

XRT86VX38IB256ES Applications


There are a lot of MaxLinear, Inc. XRT86VX38IB256ES Telecom applications.

  • Integrated Multi-Service Access Platforms (IMAPs)
  • M13 MUX
  • T1 Digital Cross Connects (DSX-1)
  • DSLAMs
  • E1 Multiplexer
  • Channel Banks
  • Private branch exchange (PBX)
  • Digital Cross Connect Systems
  • T1 Rates PCM Line Interface
  • Cable Telephony

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