XRT83VSH28ES Overview
A 225-BGA package is used to reduce board space requirements.A Bulk-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.There are 8 circuits in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.14V~3.47V with a higher voltage.
XRT83VSH28ES Features
Available in the 225-BGA package
XRT83VSH28ES Applications
There are a lot of MaxLinear, Inc. XRT83VSH28ES Telecom applications.
- Home Side Box
- ATM Switches
- Channel Service Units (CSUs): T1/E1/J1
- T1 Digital Cross Connects (DSX-1)
- High-Density T1/E1/J1 interfaces for Multiplexers
- Digital access cross connects
- Switching Systems
- Hybrid fiber coax (HFC)
- Inverse Multiplexing for ATM (IMA)
- E2 Rates PCM Line Interface
