XRT75L03DIV Overview
To save board space, the 128-LQFP Exposed Pad package is used.For telecommunications equipment packing, the Tray method is used.A Surface Mount-mount is used for mounting the telecom circuit.A 3 circuit is the heart of this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.There is a supply current of 480mA for telecom equipment to operate on.
XRT75L03DIV Features
Available in the 128-LQFP Exposed Pad package
XRT75L03DIV Applications
There are a lot of MaxLinear, Inc. XRT75L03DIV Telecom applications.
- M13 MUX
- Dual battery supply voltage SLICs
- Fiber
- Network Multiplexing and Terminating Equipment
- Interfaces to SONET STS-1 Networks
- Fractional T1/E1/J1
- High speed data transmission line cards
- SDH Multiplexers
- ISDN NT1/TA
- Voice over IP/DSL
