XRT73L06IB-F Overview
Space is saved on the board by using the 217-BBGA package.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.A 6-circuit composes this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Operating temperatures of -40°C~85°C can ensure reliable performance.
XRT73L06IB-F Features
Available in the 217-BBGA package
XRT73L06IB-F Applications
There are a lot of MaxLinear, Inc. XRT73L06IB-F Telecom applications.
- Integrated Multi-Service Access Platforms (IMAPs)
- Codec function on telephone switch line cards
- Interfaces to DS3
- PBX (Private Branch Exchange)
- Fiber
- T2 Rates PCM Line Interface
- Digital Cross-Connect Systems
- Cable Telephony
- ATM equipment with integrated DS1 interfaces
- Digital Cross Connect Systems
